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450MHz CDMA/OFDM LNA/Mixer
Power-Supply Layout
To minimize coupling between different sections of the
IC, use a star configuration, which has a large decou-
pling capacitor at a central V CC node. The V CC traces
branch out from this node, each going to a separate
V CC pin of the MAX2335. At the end of each trace is a
bypass capacitor with impedance to ground less than
1 ? at the frequency of interest. This arrangement pro-
vides local decoupling at each V CC pin. Use at least
one via per bypass capacitor for a low-inductance
ground connection. Also, connect the exposed paddle
to the PC board GND with multiple vias to provide the
lowest inductance ground connection possible.
Table 3. MAX2335 Mixer Input Impedance
in HGHL Mode
Matching Network Layout
The layout of a matching network can be very sensitive
to parasitic circuit elements. To minimize parasitic
inductance, keep all traces short and place compo-
nents as close to the IC as possible.
Use high-Q components for the LNA input-matching
network to achieve the lowest possible noise figure.
Keep the distance between the differential signal lines
at the mixer outputs constant and make both lines of
equal length to ensure signal balance.
Chip Information
PROCESS: SiGe
Table 4. MAX2335 Mixer Output
Impedance (Shunt RC) in HGHL Mode
FREQUENCY (MHz)
400
410
420
430
440
450
460
470
S11 (dB)
-1.2
-1.229
-1.247
-1.24
-1.24
-1.25
-1.28
-1.32
∠ S11
(DEGREES)
77.23
74.52
71.7
69.124
66.47
63.97
61.455
58.68
IF FREQUENCY
(MHz)
80
100
120
140
160
190
EQUIVALENT
SHUNT
RESISTANCE
(k ? )
17.7
16.961
15.79
14.616
13.49
11.87
EQUIVALENT
SHUNT
CAPACITANCE
(pF)
1.21
1.21
1.21
1.21
1.21
1.21
480
490
500
-1.33
-1.35
-1.35
55.87
53.565
50.87
8
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